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DHCOM i.MX8M Plus

NEW
DHCOM i.MX8M Plus
DHCOM i.MX8M Plus
DHCOM i.MX8M Plus
NEW

Powerful dual or quad Cortex-A53 processor with Neural Processing Unit.

  • Real-time control, machine learning, AI, advanced multimedia, industrial automation.
  • NPU with up to 2.3 TOPS enables matrix calculations e.g. for pattern, speech, object recognition
  • Advanced image and video processing via video encoding and decoding
  • Compatible with other modules from the DHCOM family (SODIMM-200 socket)
  • No heat sink necessary thanks to 5-Cent Cooling Solution
  • Guaranteed long-term availability of 10+ years
Possible Application
Automation
Metrology
eMobility
Engineering
Health
Request product

Board type

Pluggable SOM

5-Cent Cooling available

Yes

CPU details

4x ARM Cortex-A53 up to 1.6 GHz
1x ARM Cortex-M7 up to 800 MHz

CPU vendor

NXP

CPU type

Cortex-A53
Cortex-M7

Co-processor available

Yes

Number of cores

5

GPU available

Yes

GPU type

2D / 3D GC7000UL graphics accelerator with OpenGL ES, OpenCL and Vulkan support
up to 166M triangle/s and 1Gpixel/s
Etnaviv Open Source GPU driver support

PMIC

PCA9450CHN

Features

Neuronal Processing Unit (NPU) with 2.3 TOPS to accelerate machine learning inferences,
two camera inputs and HDR ISP,
enhanced multimedia capabilities (encode and decode H.265 and H.264 at 1080p 60fps)

Security

Widevine and PlayReady DRM content protection,
public Key Cryptography with RSA and ECC algorithms,
TrustZone,
Resource Domain Controller with 4 domains and 8 regions,
Secure Boot / High Assurance Boot (HAS)

LPDDR4 DRAM 1

1 / 2 / 4 / 8 (on request) GB

E2Prom

256 Byte

microSD available

Yes

External RTC available

Yes

Bluetooth available

Yes

Bluetooth version

Bluetooth® v5.0 (BR/EDR/BLE) with chip antenna or U.FL connector

WiFi available

Yes

WiFi version

WiFi IEEE 802.11 a/b/g/n/ac with dual band (2.4 and 5 GHz)

BSP

Linux (Debian, Yocto)

Debug interface

JTAG interface on module

Power supply

3.3 or 5.0 VDC

Typ. power consumption

2.0 to 4.0 W

Operating temperature

-40 to +85 °C

Storage temperature

-40 to +85 °C

Dimensions

67.6 x 36.7 x 8.1 mm

SODIMM-200 socket

Dual Ethernet available

Yes

Ethernet 1

Gbit Ethernet or 100 Mbit Ethernet with support for Time Sensitive Networking (TSN)

Ethernet 2

100 Mbit Ethernet

MMC/SD

4 Bit mode

CAN 1

V2.0B and CAN FD

CAN 2

V2.0B and CAN FD

UART 1

Rx / Tx / Rts / Cts, up to 4.0 Mbit/s

UART 2

Rx / Tx / Rts / Cts, up to 4.0 Mbit/s

UART 3

Rx / Tx, up to 4.0 Mbit/s

SPI 1

52 Mbit/s

SPI 2

52 Mbit/s

I2C 1

320 kbit/s

I2C 2

320 kbit/s

USB host 1

High-speed

USB host 2

-

USB OTG

High-speed

MIPI®-CSI 2

4-lanes up to 1.5 Gbit/s and HDR ISP

Display RGB

24 Bit

DisplayPort

Max. 1920x1200 px, 24 bit, 60 fps

Display LVDS 1

4-lane LVDS

Touch

4-wire

I2S

1

Number of GPIOs

12

PWM output

1 PWM out, 16 Bit

Analog inputs

4x 12 Bit ADC with internal voltage reference

High-speed socket

RGMII (Gbit Ethernet)

IEEE 1588, ENET AVB, Energy efficient ethernet (EEE)

PCIe

1-lane PCI Express Gen 3

MIPI CSI-2

2-lanes up to 1.5 Gbit/s and HDR ISP

Display LVDS 2

4-lane LVDS

HDMI

HDMI 2.0 up to 1080 px @ 60 fps | DHCP 2.2 and 1.4

USB 3.0

Support for USB type C

Item Number Model (other configurations on request) Product description
HI00118 DHCM-iMX8ML8-C160-R409-F1638-SPI16-GE-CAN2-SD-RTC-WBTA-ADC-T-RGB-CSI2-HS-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 4096 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 1x Gbit ethernet + RGMII on Highspeed socket, second CAN port, microSD socket, RTC, WiFi and BT module with chip antenna, 4x ADC inputs, resistive touch, RGB interface, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, Highspeed interface connector, -25 to +85 °C, DHCOM revision, SODIMM200 socket
HI00119 DHCM-iMX8ML8-C160-R204-F1638-SPI16-E-SD-RTC-T-RGB-CSI2-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 2048 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 1x100 Mbit ethernet + RGMII on Highspeed socket, microSD socket, RTC, resistive touch, RGB interface, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, -25 to +85 °C, DHCOM revision, SODIMM200 socket
HI00120 DHCM-iMX8ML8-C160-R204-F1638-SPI16-E2-CAN2-RTC-CSI2-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 2048 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 2x 100Mbit Ethernet, second CAN port, RTC, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, -25 to +85 °C, DHCOM revision, SODIMM200 socket
* Other configurations on request
What is the model number for ordering? DHCM-CPU-Cxxx-Rxxx[-Fxxxx][-SPI16][-E/E2/GE][-CAN2][-SD][-RTC][-WBT/WBTA][-ADC][-T][-DSI][-RGB/DP][-CSI2][-HS]-X-01D2
CPUiMX8ML8: i.MX8M Plus Quad (4x Cortex®-A53, 1x Cortex®-M7) with VPU, NPU, ISP and HiFi4
iMX8ML6: i.MX8M Plus Quad (4x Cortex®-A53, 1x Cortex®-M7) with VPU and ISP
iMX8ML4: i.MX8M Plus QuadLite (4x Cortex®-A53, 1x Cortex®-M7)
iMX8ML3: i.MX8M Plus Dual (2x Cortex®-A53, 1x Cortex®-M7) with VPU, NPU, ISP and HiFi4
Cxxx1,6 GHz: C160, 1,8 GHz: C180 (on request)
Rxxx1024 Mbyte: R102, 2048 Mbyte: R204, 4096 Mbyte: R409
XCommercial temperature range (0 °C - 70 °C): C, Industrial temperature range (-25 °C - 85 °C): I
Note: Industrial temp. range for eMMC version is -25 °C - 85 °C. Please contact us for -40 °C - 85 °C version
01D2DHCOM Revision, SODIMM200 socket
Options 
[-Fxxxx]8192 Mbyte eMMC: F0819, 16384 Mbyte eMMC: F1638, 32768 Mbyte eMMC: F3276
[-SPI16]16 Mbyte SPI boot flash
[-E] or [-E2] or [-GE]1x 100 Mbit Ethernet + RGMII on high speed socket: E
2x 100 Mbit Ethernet: E2
1x Gbit Ethernet + RGMII on high speed socket: GE
[-CAN2]Second CAN port available
[-SD]microSD socket: SD
[-RTC]Low power temperature compensated real time clock (instead of CPU internal RTC)
[-WBT] or [-WBTA]WiFi and Bluetooth® via Murata 2AE module with U.FL connector: WBT
WiFi and Bluetooth® via Murata 2AE module with Chip antenna: WBTA
[-ADC]4x A/D converter inputs
[-T]Resistive touch controller
[-DSI]MIPI-DSI interface connected to LVDS SODIMM-200 connections (Note: LVDS is then not available at SODIMM-200)
[-RGB] or [-DP]RGB interface at SODIMM-200: RGB
DisplayPortTM interface at SODIMM-200: DP
Note: In both cases, option –DSI is then not possible.
[-CSI2]MIPI-CSI2 interface connected to parallel camera SODIMM-200 connections
[-HS]High speed interface connector
Image Title Description
MIPI-camera by Vision Components MIPI-camera by Vision Components VC MIPI IMX327-C

The DHCOM i.MX8M Plus System on Module is based on the Dual or Quad Cortex A53 processor i.MX8M Plus and is particularly powerful. The Neural Processing Unit with up to 2.3 TOPS enables matrix calculations for machine learning on embedded systems. The proven i.MX application processors from NXP are based on the ARM architecture and are designed for low power consumption. Our DHCOM i.MX8M Plus enables advanced image and video processing using video encoding and decoding and is compatible with our other modules from the DHCOM family thanks to the SODIMM-200 socket. Thanks to the 5-cent cooling solution, no additional heat sink is required, which has a positive effect on the dimensions. The DHCOM i.MX8M Plus is suitable for all common industrial applications and has a guaranteed long-term availability of 10+ years.

Downloads
  Name Size
Datasheet DHCOM i.MX8M Plus ~ 5 MB
USM DHCOM i.MX8M Plus USM DHCOM i.MX8M Plus 2 MB
Related Links

Board type

Pluggable SOM

5-Cent Cooling available

Yes

CPU details

4x ARM Cortex-A53 up to 1.6 GHz
1x ARM Cortex-M7 up to 800 MHz

CPU vendor

NXP

CPU type

Cortex-A53
Cortex-M7

Co-processor available

Yes

Number of cores

5

GPU available

Yes

GPU type

2D / 3D GC7000UL graphics accelerator with OpenGL ES, OpenCL and Vulkan support
up to 166M triangle/s and 1Gpixel/s
Etnaviv Open Source GPU driver support

PMIC

PCA9450CHN

Features

Neuronal Processing Unit (NPU) with 2.3 TOPS to accelerate machine learning inferences,
two camera inputs and HDR ISP,
enhanced multimedia capabilities (encode and decode H.265 and H.264 at 1080p 60fps)

Security

Widevine and PlayReady DRM content protection,
public Key Cryptography with RSA and ECC algorithms,
TrustZone,
Resource Domain Controller with 4 domains and 8 regions,
Secure Boot / High Assurance Boot (HAS)

LPDDR4 DRAM 1

1 / 2 / 4 / 8 (on request) GB

E2Prom

256 Byte

microSD available

Yes

External RTC available

Yes

Bluetooth available

Yes

Bluetooth version

Bluetooth® v5.0 (BR/EDR/BLE) with chip antenna or U.FL connector

WiFi available

Yes

WiFi version

WiFi IEEE 802.11 a/b/g/n/ac with dual band (2.4 and 5 GHz)

BSP

Linux (Debian, Yocto)

Debug interface

JTAG interface on module

Power supply

3.3 or 5.0 VDC

Typ. power consumption

2.0 to 4.0 W

Operating temperature

-40 to +85 °C

Storage temperature

-40 to +85 °C

Dimensions

67.6 x 36.7 x 8.1 mm

SODIMM-200 socket

Dual Ethernet available

Yes

Ethernet 1

Gbit Ethernet or 100 Mbit Ethernet with support for Time Sensitive Networking (TSN)

Ethernet 2

100 Mbit Ethernet

MMC/SD

4 Bit mode

CAN 1

V2.0B and CAN FD

CAN 2

V2.0B and CAN FD

UART 1

Rx / Tx / Rts / Cts, up to 4.0 Mbit/s

UART 2

Rx / Tx / Rts / Cts, up to 4.0 Mbit/s

UART 3

Rx / Tx, up to 4.0 Mbit/s

SPI 1

52 Mbit/s

SPI 2

52 Mbit/s

I2C 1

320 kbit/s

I2C 2

320 kbit/s

USB host 1

High-speed

USB host 2

-

USB OTG

High-speed

MIPI®-CSI 2

4-lanes up to 1.5 Gbit/s and HDR ISP

Display RGB

24 Bit

DisplayPort

Max. 1920x1200 px, 24 bit, 60 fps

Display LVDS 1

4-lane LVDS

Touch

4-wire

I2S

1

Number of GPIOs

12

PWM output

1 PWM out, 16 Bit

Analog inputs

4x 12 Bit ADC with internal voltage reference

High-speed socket

RGMII (Gbit Ethernet)

IEEE 1588, ENET AVB, Energy efficient ethernet (EEE)

PCIe

1-lane PCI Express Gen 3

MIPI CSI-2

2-lanes up to 1.5 Gbit/s and HDR ISP

Display LVDS 2

4-lane LVDS

HDMI

HDMI 2.0 up to 1080 px @ 60 fps | DHCP 2.2 and 1.4

USB 3.0

Support for USB type C

Item Number Model (other configurations on request) Product description
HI00118 DHCM-iMX8ML8-C160-R409-F1638-SPI16-GE-CAN2-SD-RTC-WBTA-ADC-T-RGB-CSI2-HS-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 4096 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 1x Gbit ethernet + RGMII on Highspeed socket, second CAN port, microSD socket, RTC, WiFi and BT module with chip antenna, 4x ADC inputs, resistive touch, RGB interface, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, Highspeed interface connector, -25 to +85 °C, DHCOM revision, SODIMM200 socket
HI00119 DHCM-iMX8ML8-C160-R204-F1638-SPI16-E-SD-RTC-T-RGB-CSI2-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 2048 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 1x100 Mbit ethernet + RGMII on Highspeed socket, microSD socket, RTC, resistive touch, RGB interface, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, -25 to +85 °C, DHCOM revision, SODIMM200 socket
HI00120 DHCM-iMX8ML8-C160-R204-F1638-SPI16-E2-CAN2-RTC-CSI2-I-01D2 DHCOM i.MX8M Plus Quad with VPU, NPU, ISP, HiFi4, 1.6 GHz, 2048 MByte DRAM, 16384 MByte eMMC flash, 16 MByte SPI boot flash, 2x 100Mbit Ethernet, second CAN port, RTC, MIPI-CSI2 interface connected to parallel camera SODIMM200 connections, -25 to +85 °C, DHCOM revision, SODIMM200 socket
* Other configurations on request
What is the model number for ordering? DHCM-CPU-Cxxx-Rxxx[-Fxxxx][-SPI16][-E/E2/GE][-CAN2][-SD][-RTC][-WBT/WBTA][-ADC][-T][-DSI][-RGB/DP][-CSI2][-HS]-X-01D2
CPUiMX8ML8: i.MX8M Plus Quad (4x Cortex®-A53, 1x Cortex®-M7) with VPU, NPU, ISP and HiFi4
iMX8ML6: i.MX8M Plus Quad (4x Cortex®-A53, 1x Cortex®-M7) with VPU and ISP
iMX8ML4: i.MX8M Plus QuadLite (4x Cortex®-A53, 1x Cortex®-M7)
iMX8ML3: i.MX8M Plus Dual (2x Cortex®-A53, 1x Cortex®-M7) with VPU, NPU, ISP and HiFi4
Cxxx1,6 GHz: C160, 1,8 GHz: C180 (on request)
Rxxx1024 Mbyte: R102, 2048 Mbyte: R204, 4096 Mbyte: R409
XCommercial temperature range (0 °C - 70 °C): C, Industrial temperature range (-25 °C - 85 °C): I
Note: Industrial temp. range for eMMC version is -25 °C - 85 °C. Please contact us for -40 °C - 85 °C version
01D2DHCOM Revision, SODIMM200 socket
Options 
[-Fxxxx]8192 Mbyte eMMC: F0819, 16384 Mbyte eMMC: F1638, 32768 Mbyte eMMC: F3276
[-SPI16]16 Mbyte SPI boot flash
[-E] or [-E2] or [-GE]1x 100 Mbit Ethernet + RGMII on high speed socket: E
2x 100 Mbit Ethernet: E2
1x Gbit Ethernet + RGMII on high speed socket: GE
[-CAN2]Second CAN port available
[-SD]microSD socket: SD
[-RTC]Low power temperature compensated real time clock (instead of CPU internal RTC)
[-WBT] or [-WBTA]WiFi and Bluetooth® via Murata 2AE module with U.FL connector: WBT
WiFi and Bluetooth® via Murata 2AE module with Chip antenna: WBTA
[-ADC]4x A/D converter inputs
[-T]Resistive touch controller
[-DSI]MIPI-DSI interface connected to LVDS SODIMM-200 connections (Note: LVDS is then not available at SODIMM-200)
[-RGB] or [-DP]RGB interface at SODIMM-200: RGB
DisplayPortTM interface at SODIMM-200: DP
Note: In both cases, option –DSI is then not possible.
[-CSI2]MIPI-CSI2 interface connected to parallel camera SODIMM-200 connections
[-HS]High speed interface connector

Image Title Description
MIPI-camera by Vision Components MIPI-camera by Vision Components VC MIPI IMX327-C

The DHCOM i.MX8M Plus System on Module is based on the Dual or Quad Cortex A53 processor i.MX8M Plus and is particularly powerful. The Neural Processing Unit with up to 2.3 TOPS enables matrix calculations for machine learning on embedded systems. The proven i.MX application processors from NXP are based on the ARM architecture and are designed for low power consumption. Our DHCOM i.MX8M Plus enables advanced image and video processing using video encoding and decoding and is compatible with our other modules from the DHCOM family thanks to the SODIMM-200 socket. Thanks to the 5-cent cooling solution, no additional heat sink is required, which has a positive effect on the dimensions. The DHCOM i.MX8M Plus is suitable for all common industrial applications and has a guaranteed long-term availability of 10+ years.

  Name Size
Datasheet DHCOM i.MX8M Plus ~ 5 MB
USM DHCOM i.MX8M Plus USM DHCOM i.MX8M Plus 2 MB

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