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DHCOS STM32MP2x

NEW
DHCOS STM32MP2x
DHCOS STM32MP2x
NEW

Based on STM32MP2x

  • DHCOS soldering module combines flexibility and pin-compatibility
  • Highlights: LPDDR4 RAM, SPI boot flash, eMMC flash, GBit Ethernet, WiFi/BT
  • Dual Cortex-A35 @1.2 GHz and Cortex-M33 @400 MHz
  • Multimedia support with 3D GPU, display, video, camera
  • STPMIC25 supports low power modes
  • Mainline Linux support (also for Vivante GPU)
  • Space-saving with only 30 x 40 mm
  • Guaranteed long-term availability of 10+ years

 

Possible Application
Automation
Metrology
eMobility
Engineering
Health
Request product

Board type

Solderable SOM

5-Cent Cooling available

No

CPU details

2x ARM Cortex-A35 up to 1.5 GHz
1x ARM Cortex-M33 up to 400 MHz

CPU vendor

ST

CPU type

Cortex-A35, Cortex-M33

Co-processor available

Yes

Number of cores

4, 2

GPU available

Yes

GPU type

3D GPU: VeriSilicon® - Up to 150 Mtriangle/s, 900 Mpixel/s with OpenGL® ES 3.1 - Vulkan 1.3 and OpenCL™ 3.0, OpenVX™ 1.3 support

PMIC

STPMIC25APQR

Features

Neuronal Processing Unit (NPU) VeriSilicon® with up to 900 MHz and 1.35 TOPS | Video decode / encode H264 up to 1080p60

Security

"Secure boot | TrustZone® peripherals | active tamper | environmental monitors |
display secure layers | hardware accelerators | Complete resource isolation framework | “On-the-fly” DDR encryption/decryption (AES-128)"

LPDDR4 DRAM

1 / 2 / 4 GB

DRAM details

LPDDR4-2400 32-bit

eMMC flash

4 / 8 / 16 GB

eMMC details

8-bit eMMC with HS200 support

SPI NOR flash

4 MB

E2Prom

4 kB

microSD available

No

External RTC available

Yes

Bluetooth available

Yes

Bluetooth version

Bluetooth® v5.4 BR/EDR/LE

WiFi available

Yes

WiFi version

Tri band 2.4 GHz, 5 GHz and 6 GHz for IEEE802.11a/b/g/n/ac/ax

BSP

Linux (Yocto)

Debug interface

JTAG interface on module

Power supply

5.0 VDC

Typ. power consumption

1.5 to 3.5 W

Operating temperature

-40 to +85 °C

Storage temperature

-40 to +85 °C

Dimensions

40.0 x 30.0 x 3.2 mm

Available interfaces for DHCOS M-Size LGA (370 pins)

Dual Ethernet available

Yes

Ethernet 0 - 1

2x Gbit Ethernet, TSN, IEEE 1588v2 hardware, MII/RMII/RGMII

SDIO 0

1x 4 bit mode, SDIO 4.0 / SD 3.01 / eMMC 5.1, 1V8 voltage transition for UHS-1 modes of SD card supported

SDIO 1

1x 4 bit mode, SDIO 4.0 / SD 3.01 / eMMC 5.1

CAN 0 - 1

2x FDCAN / TTCAN

UART 0

1x Rx / Tx for Linux and bootloader console connection

UART 1 - 3

3x Rx / Tx / Rts / Cts, up to 10.0 Mbit/s

SPI

1x 50 Mbit/s

QuadSPI

1x Single, dual and quad communication

I2C 0 - 1

2x Up to 1 Mbit/s

USB 0

1x USB 3.0 with 5Gbps | Operation mode USB 3.2 Gen 1x1 | Interfaces: USB-A, USB-C and microUSB

USB 1

1x USB 2.0 Host

MIPI-CSI2

1x 2-lanes up to 2.5 Gbit/s | 5 Mpixels @30 fps

Display RGB

1x 18-bit RGB666 | up to FHD (1920 × 1080) @60 fps

MIPI-DSI

1x 4-lanes up to 2.5 Gbit/s | Up to QXGA (2048 × 1536) @60 fps

LVDS

1x Dual Link, 2x 4-lane LVDS | Up to 1.1 Gbit/s per
lane | Up to QXGA (2048 × 1536) @60 fps

PCIe

1x 1-lane PCI Express Gen2 up to 5 Gbit/s

PWM

2x PWM out, 16 Bit

Analog

2x 12 Bit ADC with internal or external voltage reference

I2S

1x

Number of GPIOs

15x

Boot mode

4x, UART/USB, Serial NOR, eMMC, SD-Card, Development boot

Supervisor signals

Reset_in, Reset_out, Power_good, Power_button, Interrupt_highest_priority

Power inputs

4x VCC_IN, VRTC, VBAT, ADC_VREF

Power outputs

5x VRGMII, VOUT, VSDIO0, VSDIO1, VRGB

SoC special features

USB CC

1x USB Type-C® Power Delivery control with two CC lines PHY

RTC EVI

1x Real Time Clock event input

WiFi / BT host wake

2x WiFi and Bluetooth Host wake inputs

Ethernet 2

1x Optionally Gbit Ethernet switch providing third external PHY interface

Item Number Model (other configurations on request) Product description
HS00046 DHCS-STM32MP255C-C120-R102-EE-F0819-SPI04-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 1024 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection9-SPI4-USB3-I-01LG
HS00045 DHCS-STM32MP255C-C120-R204-EE-F0819-SPI04-RTC-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 2048 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), USB3, Industrial te
HS00044 DHCS-STM32MP255C-C120-R204-EE-F0819-SPI04-RTC-WBT-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 2048 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), WiFi/BT via Murata 2FY, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection
HS00043 DHCS-STM32MP255C-C120-R409-EE-F1638-SPI04-RTC-WBT-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 4096 MByte LPDDR4 RAM, 256 kbit EEPROM, 16384 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), WiFi/BT via Murata 2FY, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection
* Other configurations on request
What is the model number for ordering? DHCS-STM32MP2xxx-C120-Rxxx-EE[-F[P]xxxx][-SPIxx][-RTC][-WBT][-RGB][-PCIe/USB3][-ETH3]-I-01LG
CPUSTM32MP257C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI / NN, Secure Boot, Cryptography, DRAM enc/dec, PKA
STM32MP255C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 2xEthernet, 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI / NN, Secure Boot, Cryptography, DRAM enc/dec, PKA
STM32MP253C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 2xEthernet, 3xFD-CAN, Secure Boot, Cryptography, DRAM enc/dec, PKA
Note: Please contact us for A-Type devices without Secure Boot and Cryptography support
Cxxx1.2 GHz: C120
Note: Please contact us for 1.5 GHz F-Type devices: C150 
Rxxx1024 Mbyte: R102, 2048 Mbyte: R204, 4096 Mbyte: R409
EE256 kbit EEPROM
XIndustrial temperature range (-25 °C - 85 °C): I
Note:
- Industrial temperature range for eMMC and LPDDR4 version is -25 °C - 85 °C. Please contact us for -40 °C - 85 °C version
- Please contact us commercial temperature range (0 °C - 70 °C): C 
01LGDHCOS Revision, LGA connection
Options 
[-Fxxxx]

4096 Mbyte eMMC: F0409, 8192 Mbyte eMMC: F0819, 16384 Mbyte eMMC: F1638
Note: 

- Please contact us for eMMC with pSLC support: FPxxxx
- Other sizes on request

[-SPI4]

4 Mbyte SPI boot flash

Note: Other sizes on request

[-RTC]Low power temperature compensated real time clock (instead of CPU internal RTC)
[-WBT]WiFi and Bluetooth® via Murata 2FY module with U.FL connector: WBT 
Note: SDIO1 is no longer available.
[-RGB]18bit RGB interface is available. 
Note: UART1 and UART2 are then no longer available.
[-PCIe] or [-USB3]Either USB3 or PCIe is available on the DHCOS connection
[-ETH3]Ethernet port 3 is available on SoC special feature pins of the DHCOS standard. Some GPIOs and I2S are then no longer available.

The solderable DHCOS STM32MP2x System on Module based on the powerful STM32MP25x processor from STMicroelectronics combines flexibility and pin-compatibility. Equipped with dual Cortex-A35 cores with a clock frequency of 1.2 GHz and an additional Cortex-M33 co-processor with 400 MHz, the DHCOS STM32MP2x offers powerful computing performance with optimized energy efficiency. Thanks to LPDDR4 RAM, SPI boot flash, eMMC flash, GBit Ethernet and integrated WiFi and Bluetooth, comprehensive connectivity is guaranteed. Support for a 3D GPU with extended graphics functions for displays, videos and cameras ensures demanding multimedia applications. The use of the STPMIC1 power management IC enables versatile low-power modes, ideal for energy-efficient applications. Another highlight is the mainline Linux support, which enables easy integration and software updates. With a compact size of just 30 x 40 mm, the SOM is perfect for space-saving designs without compromising on performance. Thanks to the guaranteed long-term availability of 10+ years, the DHCOS STM32MP2x offers maximum investment security - an ideal choice for industrial and demanding IoT applications.
 

Downloads
  Name Size
Datasheet DHCOS STM32MP2x ~ 5 MB

Board type

Solderable SOM

5-Cent Cooling available

No

CPU details

2x ARM Cortex-A35 up to 1.5 GHz
1x ARM Cortex-M33 up to 400 MHz

CPU vendor

ST

CPU type

Cortex-A35, Cortex-M33

Co-processor available

Yes

Number of cores

4, 2

GPU available

Yes

GPU type

3D GPU: VeriSilicon® - Up to 150 Mtriangle/s, 900 Mpixel/s with OpenGL® ES 3.1 - Vulkan 1.3 and OpenCL™ 3.0, OpenVX™ 1.3 support

PMIC

STPMIC25APQR

Features

Neuronal Processing Unit (NPU) VeriSilicon® with up to 900 MHz and 1.35 TOPS | Video decode / encode H264 up to 1080p60

Security

"Secure boot | TrustZone® peripherals | active tamper | environmental monitors |
display secure layers | hardware accelerators | Complete resource isolation framework | “On-the-fly” DDR encryption/decryption (AES-128)"

LPDDR4 DRAM

1 / 2 / 4 GB

DRAM details

LPDDR4-2400 32-bit

eMMC flash

4 / 8 / 16 GB

eMMC details

8-bit eMMC with HS200 support

SPI NOR flash

4 MB

E2Prom

4 kB

microSD available

No

External RTC available

Yes

Bluetooth available

Yes

Bluetooth version

Bluetooth® v5.4 BR/EDR/LE

WiFi available

Yes

WiFi version

Tri band 2.4 GHz, 5 GHz and 6 GHz for IEEE802.11a/b/g/n/ac/ax

BSP

Linux (Yocto)

Debug interface

JTAG interface on module

Power supply

5.0 VDC

Typ. power consumption

1.5 to 3.5 W

Operating temperature

-40 to +85 °C

Storage temperature

-40 to +85 °C

Dimensions

40.0 x 30.0 x 3.2 mm

Available interfaces for DHCOS M-Size LGA (370 pins)

Dual Ethernet available

Yes

Ethernet 0 - 1

2x Gbit Ethernet, TSN, IEEE 1588v2 hardware, MII/RMII/RGMII

SDIO 0

1x 4 bit mode, SDIO 4.0 / SD 3.01 / eMMC 5.1, 1V8 voltage transition for UHS-1 modes of SD card supported

SDIO 1

1x 4 bit mode, SDIO 4.0 / SD 3.01 / eMMC 5.1

CAN 0 - 1

2x FDCAN / TTCAN

UART 0

1x Rx / Tx for Linux and bootloader console connection

UART 1 - 3

3x Rx / Tx / Rts / Cts, up to 10.0 Mbit/s

SPI

1x 50 Mbit/s

QuadSPI

1x Single, dual and quad communication

I2C 0 - 1

2x Up to 1 Mbit/s

USB 0

1x USB 3.0 with 5Gbps | Operation mode USB 3.2 Gen 1x1 | Interfaces: USB-A, USB-C and microUSB

USB 1

1x USB 2.0 Host

MIPI-CSI2

1x 2-lanes up to 2.5 Gbit/s | 5 Mpixels @30 fps

Display RGB

1x 18-bit RGB666 | up to FHD (1920 × 1080) @60 fps

MIPI-DSI

1x 4-lanes up to 2.5 Gbit/s | Up to QXGA (2048 × 1536) @60 fps

LVDS

1x Dual Link, 2x 4-lane LVDS | Up to 1.1 Gbit/s per
lane | Up to QXGA (2048 × 1536) @60 fps

PCIe

1x 1-lane PCI Express Gen2 up to 5 Gbit/s

PWM

2x PWM out, 16 Bit

Analog

2x 12 Bit ADC with internal or external voltage reference

I2S

1x

Number of GPIOs

15x

Boot mode

4x, UART/USB, Serial NOR, eMMC, SD-Card, Development boot

Supervisor signals

Reset_in, Reset_out, Power_good, Power_button, Interrupt_highest_priority

Power inputs

4x VCC_IN, VRTC, VBAT, ADC_VREF

Power outputs

5x VRGMII, VOUT, VSDIO0, VSDIO1, VRGB

SoC special features

USB CC

1x USB Type-C® Power Delivery control with two CC lines PHY

RTC EVI

1x Real Time Clock event input

WiFi / BT host wake

2x WiFi and Bluetooth Host wake inputs

Ethernet 2

1x Optionally Gbit Ethernet switch providing third external PHY interface

Item Number Model (other configurations on request) Product description
HS00046 DHCS-STM32MP255C-C120-R102-EE-F0819-SPI04-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 1024 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection9-SPI4-USB3-I-01LG
HS00045 DHCS-STM32MP255C-C120-R204-EE-F0819-SPI04-RTC-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 2048 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), USB3, Industrial te
HS00044 DHCS-STM32MP255C-C120-R204-EE-F0819-SPI04-RTC-WBT-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 2048 MByte LPDDR4 RAM, 256 kbit EEPROM, 8192 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), WiFi/BT via Murata 2FY, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection
HS00043 DHCS-STM32MP255C-C120-R409-EE-F1638-SPI04-RTC-WBT-USB3-I-01LG DHCOS STM32MP255C, 1.2 GHz, 4096 MByte LPDDR4 RAM, 256 kbit EEPROM, 16384 MByte eMMC flash, 4 MByte SPI boot flash, temp. compensated RTC (instead of CPU internal RTC), WiFi/BT via Murata 2FY, USB3, Industrial temp. -25 to +85 °C, DHCOS revision, LGA connection
* Other configurations on request
What is the model number for ordering? DHCS-STM32MP2xxx-C120-Rxxx-EE[-F[P]xxxx][-SPIxx][-RTC][-WBT][-RGB][-PCIe/USB3][-ETH3]-I-01LG
CPUSTM32MP257C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI / NN, Secure Boot, Cryptography, DRAM enc/dec, PKA
STM32MP255C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 2xEthernet, 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI / NN, Secure Boot, Cryptography, DRAM enc/dec, PKA
STM32MP253C: 2xCortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 2xEthernet, 3xFD-CAN, Secure Boot, Cryptography, DRAM enc/dec, PKA
Note: Please contact us for A-Type devices without Secure Boot and Cryptography support
Cxxx1.2 GHz: C120
Note: Please contact us for 1.5 GHz F-Type devices: C150 
Rxxx1024 Mbyte: R102, 2048 Mbyte: R204, 4096 Mbyte: R409
EE256 kbit EEPROM
XIndustrial temperature range (-25 °C - 85 °C): I
Note:
- Industrial temperature range for eMMC and LPDDR4 version is -25 °C - 85 °C. Please contact us for -40 °C - 85 °C version
- Please contact us commercial temperature range (0 °C - 70 °C): C 
01LGDHCOS Revision, LGA connection
Options 
[-Fxxxx]

4096 Mbyte eMMC: F0409, 8192 Mbyte eMMC: F0819, 16384 Mbyte eMMC: F1638
Note: 

- Please contact us for eMMC with pSLC support: FPxxxx
- Other sizes on request

[-SPI4]

4 Mbyte SPI boot flash

Note: Other sizes on request

[-RTC]Low power temperature compensated real time clock (instead of CPU internal RTC)
[-WBT]WiFi and Bluetooth® via Murata 2FY module with U.FL connector: WBT 
Note: SDIO1 is no longer available.
[-RGB]18bit RGB interface is available. 
Note: UART1 and UART2 are then no longer available.
[-PCIe] or [-USB3]Either USB3 or PCIe is available on the DHCOS connection
[-ETH3]Ethernet port 3 is available on SoC special feature pins of the DHCOS standard. Some GPIOs and I2S are then no longer available.

The solderable DHCOS STM32MP2x System on Module based on the powerful STM32MP25x processor from STMicroelectronics combines flexibility and pin-compatibility. Equipped with dual Cortex-A35 cores with a clock frequency of 1.2 GHz and an additional Cortex-M33 co-processor with 400 MHz, the DHCOS STM32MP2x offers powerful computing performance with optimized energy efficiency. Thanks to LPDDR4 RAM, SPI boot flash, eMMC flash, GBit Ethernet and integrated WiFi and Bluetooth, comprehensive connectivity is guaranteed. Support for a 3D GPU with extended graphics functions for displays, videos and cameras ensures demanding multimedia applications. The use of the STPMIC1 power management IC enables versatile low-power modes, ideal for energy-efficient applications. Another highlight is the mainline Linux support, which enables easy integration and software updates. With a compact size of just 30 x 40 mm, the SOM is perfect for space-saving designs without compromising on performance. Thanks to the guaranteed long-term availability of 10+ years, the DHCOS STM32MP2x offers maximum investment security - an ideal choice for industrial and demanding IoT applications.
 

  Name Size
Datasheet DHCOS STM32MP2x ~ 5 MB
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