DHCOM i.MX8M Plus with 5-Cent Cooling Solution

Date : 15. August 2022

Our innovative 5-Cent Cooling Solution is also compatible with the new DHCOM i.MX8M Plus SOM. The powerful System on Module with NPU can perform numerous complex computing operations in the shortest possible time. This generates heat, which must be dissipated, especially when computer modules are installed in devices with housings. With our 5-Cent Cooling Solution we offer a time-, space- and cost-saving cooling solution that does not require any heat sinks. The DHCOM i.MX8M Plus, like all our System on Modules, is designed for a storage and operating temperature of -40 to +85 °C. The DHCOM i.MX8M Plus is equipped with a 5-cent cooling solution.

In our cooling solution, heat is dissipated from the processor through thermal vias into the inner copper layers of the PCB via a 5-cent copper area with the aid of a gap pad. There, the heat is distributed evenly over the carrier board and is dissipated by it to the environment primarily by convection and thermal radiation. The uniform heat distribution protects the remaining components from overheating. If required, additional heat dissipation can be connected to the 5-cent copper area on the underside of the carrier board. For example, the housing can be used for optimum heat dissipation via another gap pad.

The 5-Cent Cooling Solution offers numerous advantages:

• Cost-saving: only gap pad required, no costs for heat sink and mounting 
• Space-saving: slim product design, as no space is required for heat sinks 
• Time-saving: easy handling of the gap pads by simple gluing on
• Robust: cooling solution with low weight is shock and vibration resistant

The innovative Cooling Solution is compatible with the following DHCOM modules:

• DHCOM i.MX8M Plus
• DHCOM i.MX6 Solo | DualLite | Dual | Quad
• DHCOM AM335x
• DHCOM STM32MP15